Automatic ball detection
Create circular regions around solder balls and review the detected radius for each position

BGA & VOID INSPECTION
Detect BGA balls, review radius values and overlapping shapes, and inspect internal voids in the same template-based X-ray workflow

01 / PRODUCT FOCUS
Create circular regions around solder balls and review the detected radius for each position
Identify adjacent or overlapping solder-ball shapes that need closer inspection
Use the shared HADI void tools to examine internal voids alongside BGA geometry
02 / CAPABILITIES
The HADI interface keeps image preparation, inspection regions, results, and supporting tools in one working environment

BGA DETECTION
HADI-BGA places circular regions over detected balls and displays radius measurements, giving reviewers a consistent starting point for BGA assessment

VOID INSPECTION
Use template-based void inspection to identify low-contrast regions and evaluate the area inside selected solder joints

COMMON TOOLKIT
Image filters, calibration, alignment, and measurement tools help normalize the image before the final BGA or void decision
03 / WORKFLOW
Define the part and save its inspection template
Locate BGA balls and overlapping structures
Review radius values and internal voids
Capture and export the inspection result
04 / SHARED HADI TOOLKIT
Every HADI product includes the foundational tools needed to load, prepare, measure, review, and communicate 2D X-ray images
SOFTWARE DOWNLOADS
Find archived installers, product manuals, and the industrial software guide in one library. Check the version and license requirements before changing a production workstation.
Open software downloads